System for the radiation treatment of substrates
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United States of America Patent
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Mar 22, 2016
Grant Date -
Jul 23, 2015
app pub date -
Jul 26, 2013
filing date -
Aug 31, 2012
priority date (Note) -
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Abstract
A system for the radiation treatment of substrates, which comprises, in a chamber above the substrate holders for fitting substrates to be treated, at least one radiation source, and wherein the chamber comprises means for maintaining a gas flow in the chamber with at least one gas inlet and at least one gas outlet, characterized in that the at least one gas inlet is disposed in the region of the substrate holders in such a way that gas flowing in through the at least one gas inlet first flows around the substrate holders prior to leaving the chamber again, either directly and/or after flowing around the at least one radiation source, through the gas outlet.
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