Method of manufacturing a printed circuit board with circuit visible
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United States of America Patent
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Mar 15, 2016
Grant Date -
May 29, 2014
app pub date -
Nov 18, 2013
filing date -
Nov 28, 2012
priority date (Note) -
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Abstract
A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.
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