Cooling systems for electrical equipment
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United States of America Patent
Stats
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Mar 8, 2016
Grant Date -
Dec 20, 2012
app pub date -
Aug 28, 2012
filing date -
Jun 23, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- F28D:HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTH....
- F25B:REFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBIN....
- F25D:REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR F....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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