Multi-transistor exposed conductive clip for semiconductor packages
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United States of America Patent
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Mar 8, 2016
Grant Date -
May 30, 2013
app pub date -
Dec 27, 2012
filing date -
May 19, 2011
priority date (Note) -
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Abstract
One exemplary disclosed embodiment comprises a semiconductor package including multiple transistors coupled to an exposed conductive clip. A driver integrated circuit (IC) may control the transistors to implement a buck converter. By exposing a top surface of the exposed conductive clip outside of a mold compound of the package, enhanced thermal performance is provided. Additionally, the conductive clip provides a short distance, high current carrying route between transistors of the package, providing higher electrical performance and reduced form factor compared to conventional designs with individually packaged transistors.
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