Turret handlers and methods of operations thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 14, 2017
Grant Date -
Aug 28, 2014
app pub date -
Feb 27, 2013
filing date -
Feb 27, 2013
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret of a turret handler, transporting the plurality of semiconductor components using the main turret to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component in the first set at a first test pad using a tester while transporting a second semiconductor component in the second set to a second test pad and testing the second semiconductor component using the tester while transporting the first semiconductor component out of the first test pad. The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.
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