Vapor deposition apparatus and method associated

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United States of America Patent

PATENT NO 9273396
APP PUB NO 20150275371A1
SERIAL NO

14375821

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Abstract

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A vapor deposition apparatus includes a deposition chamber for carrying out a deposition of a film on a substrate, source gas tubes for supplying a source gas, a transfer unit for transferring the substrate in the interior of the deposition chamber so that the substrate is alternately situated in a state where the substrate is located in a deposition region that faces the gas discharge port for supplying the source gas and in a state where the substrate is located in other region except the deposition region, while the source gas is supplied from a gas discharge port of any one of the source gas tubes, and a supply tube for supplying a gas containing group-V element to the substrate S located in the other region.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA CO LTDCHIYODA-KU TOKYO 100-8370

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizuta, Masashi Tochigi, JP 11 478

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