Hot runner system sealing arrangement
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United States of America Patent
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Mar 1, 2016
Grant Date -
Nov 5, 2015
app pub date -
Apr 29, 2015
filing date -
Apr 30, 2014
priority date (Note) -
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Abstract
A sealing arrangement between hot runner components includes a sealing component positioned between a first hot runner component and a second hot runner component having a molding material channel extending therebetween. The sealing component includes an opening through which the molding material channel extends. The sealing component is received in a bore in the second hot runner component such that a portion of the sealing component projects beyond the second hot runner component to create a gap between the first hot runner component and the second hot runner component. The sealing component has a hardness that is greater than a hardness of the second hot runner component and less than a hardness of the first hot runner component. Further, the sealing component has a coefficient of thermal expansion that is proximate to a coefficient of thermal expansion of the second hot runner component.
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