Laminate structures having a hole surrounding a probe for propagating millimeter waves
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United States of America Patent
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Feb 23, 2016
Grant Date -
Oct 11, 2012
app pub date -
Jun 20, 2012
filing date -
Feb 21, 2011
priority date (Note) -
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Abstract
Various embodiments of millimeter-wave systems on a printed circuit board, including a microstrip, a probe, and an RF integrated circuit, as well as methods for manufacturing said systems. Various embodiments have holes extending through lamina in the PCB, thereby improving radiation propagation. Various embodiments have conductive cages created by multiple through-holes extending through lamina in the PCB, thereby increasing radiation propagation. The manufacture of such systems is easier and less expensive than the manufacture of current systems.
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