High power ceramic on copper package
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United States of America Patent
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Feb 23, 2016
Grant Date -
May 3, 2012
app pub date -
Jan 5, 2012
filing date -
May 6, 2009
priority date (Note) -
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Abstract
According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the heat sink on the same side as the lead frame with an electrically conductive material having a melting point of 280° C. or greater.
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