Apparatus for testing wafers
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United States of America Patent
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Feb 23, 2016
Grant Date -
Jul 2, 2015
app pub date -
May 29, 2013
filing date -
Jul 26, 2012
priority date (Note) -
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Abstract
An apparatus for testing integrated circuits includes a test probe having test contacts configured to be pressed onto electrical contacts of a substrate and a frame to which the test probe is attached. A substrate support is configured to hold the substrate. A magnetic element is configured to generate a force with which the test contacts are pressed onto the electrical contacts of the integrated circuit. The magnetic element includes at least three magnet actuators which each have a distance sensor associated therewith and which are arranged around the substrate support such that distances between the magnet actuators and the frame, and between the substrate support and the test probe, are adjustable.
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