Package structure of light-emitting diode module and method for manufacturing the same
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United States of America Patent
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Feb 9, 2016
Grant Date -
Feb 4, 2016
app pub date -
Aug 4, 2014
filing date -
Aug 4, 2014
priority date (Note) -
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Abstract
The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.
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