Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
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United States of America Patent
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Feb 9, 2016
Grant Date -
Oct 16, 2014
app pub date -
Jun 26, 2014
filing date -
Nov 18, 2008
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.
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