Landing areas of bonding structures
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United States of America Patent
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Feb 9, 2016
Grant Date -
Jun 13, 2013
app pub date -
Dec 7, 2011
filing date -
Dec 7, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The metal trace includes a portion having an edge, wherein the edge is not parallel to the lengthwise direction of the metal trace. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface and the edge of the portion of the metal trace.
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