Electronic devices utilizing contact pads with protrusions and methods for fabrication
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United States of America Patent
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Feb 9, 2016
Grant Date -
Aug 20, 2015
app pub date -
Sep 4, 2013
filing date -
Sep 5, 2012
priority date (Note) -
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Abstract
An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).
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