Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
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United States of America Patent
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Feb 9, 2016
Grant Date -
Apr 24, 2014
app pub date -
Jun 24, 2013
filing date -
Oct 19, 2012
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Abstract
Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body.
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