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United States of America Patent
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Feb 9, 2016
Grant Date -
Aug 5, 2010
app pub date -
Apr 8, 2009
filing date -
Apr 8, 2008
priority date (Note) -
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Abstract
A polycrystalline diamond (PCD) compact and method for making the compact are provided. The method includes bringing a first PCD wafer and a second PCD wafer together at an interface in the presence of a bonding agent to form an unbonded assembly and bonding the wafers together at the interface at a pressure and temperature at which diamond is thermodynamically stable. The first PCD wafer is more thermally stable than the second PCD wafer.
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International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- B01J:CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, CO....
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C22C:ALLOYS
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