Integrated switch module
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United States of America Patent
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Feb 2, 2016
Grant Date -
N/A
app pub date -
Jun 28, 2011
filing date -
Jun 28, 2010
priority date (Note) -
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Abstract
An integrated RF switch module including a package customized to include at least one trace. The trace includes one or more of at least one connection pad and at least one landing pad. At least one switching die is connected to the at least one connection pad. At least one device is connected to the at least one landing pad, the at least one device configured to enhance the performance of the switching die.
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