High frequency high isolation multichip module hybrid package
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United States of America Patent
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Feb 2, 2016
Grant Date -
Mar 20, 2014
app pub date -
Feb 21, 2013
filing date -
Sep 14, 2012
priority date (Note) -
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Abstract
In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.
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