Hot bar soldering
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 2, 2016
Issued Date -
N/A
app pub date -
Aug 1, 2012
filing date -
Aug 1, 2012
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
BRIGHT MACHINES INC | 132 HAWTHORNE STREET SAN FRANCISCO CA 94107 |
International Classification(s)

- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Cheung, Dason | Fremont, US | 21 | 39 |
# of filed Patents : 21 Total Citations : 39 | |||
Kurwa, Murad | San Jose, US | 60 | 155 |
# of filed Patents : 60 Total Citations : 155 | |||
Loi, Richard | San Jose, US | 10 | 11 |
# of filed Patents : 10 Total Citations : 11 | |||
Ruiz, Mario Lopez | Zapopan Jal, MX | 4 | 3 |
# of filed Patents : 4 Total Citations : 3 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 9 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 2, 2027 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Oct 29, 2024 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Oct 28, 2024 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
Sep 20, 2024 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Sep 20, 2024 |
May 13, 2024 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
Mar 20, 2020 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, MICRO ENTITY (ORIGINAL EVENT CODE: M3551); ENTITY STATUS OF PATENT OWNER: MICROENTITY year of fee payment: 4 |
Sep 20, 2016 | I | Issuance | |
Aug 31, 2016 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jan 07, 2016 | P | Published | |
Feb 26, 2014 | F | Filing | |
Feb 26, 2013 | PD | Priority Date |

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