No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same
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United States of America Patent
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Feb 2, 2016
Grant Date -
Oct 23, 2014
app pub date -
Apr 22, 2014
filing date -
Nov 30, 2011
priority date (Note) -
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Abstract
A no-exposed-pad ball grid array (BGA) packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of outer leads formed on the metal substrate and extending to the proximity of the die. A metal layer that contains a plurality of inner leads corresponding to the plurality of outer leads and extending to the proximity of the die is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads is significantly reduced. Furthermore, the die and the plurality of inner leads are connected by metal wires, and a plurality of solder balls is attached to a back surface of the plurality of outer leads and a die pad. The die, the plurality of inner leads, and the metal wires are sealed with a molding compound.
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