Electro-polishing and porosification
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United States of America Patent
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Feb 2, 2016
Grant Date -
Apr 2, 2015
app pub date -
Sep 27, 2013
filing date -
Sep 27, 2013
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Abstract
Forming a porous layer on a silicon substrate is disclosed. Forming the porous layer can include placing a silicon substrate in a first solution and conducting a first current through the silicon substrate. It can further include conducting a second current through the silicon substrate resulting in a porous layer on the silicon substrate.
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