Surface-micromachined micro-magnetic undulator
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United States of America Patent
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Jan 26, 2016
Grant Date -
Oct 9, 2014
app pub date -
Nov 9, 2012
filing date -
Nov 11, 2011
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Abstract
Various embodiments of undulators, methods of fabricating undulators, and systems incorporating undulators are described. Certain embodiments provide a compact, electromagnetic undulator. The undulator may comprise a substrate and one or more electromagnets, which may be formed on the substrate. Certain embodiments have a period not greater than about 5 mm. The undulator may be operatively coupled with a particle accelerator to provide a free electron laser system.
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