Lead built-in type circuit package and method for producing same
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United States of America Patent
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Jan 26, 2016
Grant Date -
Sep 17, 2015
app pub date -
Dec 18, 2014
filing date -
Mar 15, 2014
priority date (Note) -
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Abstract
A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.
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