Die bonding apparatus, die picking up apparatus and die picking up method
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United States of America Patent
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Jan 26, 2016
Grant Date -
Mar 6, 2014
app pub date -
Feb 28, 2013
filing date -
Aug 29, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.
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