Additives for producing copper electrodeposits having low oxygen content
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United States of America Patent
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Jan 26, 2016
Grant Date -
Nov 28, 2013
app pub date -
May 25, 2012
filing date -
May 25, 2012
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Abstract
A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
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