Electronic device housing and method for manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 26, 2016
Grant Date -
Apr 24, 2014
app pub date -
Apr 30, 2013
filing date -
Oct 18, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A electronic device housing includes a substrate, and the electronic device housing further includes a first color layer, a metallic coating, a second color layer, and a second metallic coating formed directly on the substrate in that order. The first color layer is disposed on the substrate and covering portions of the internal surface. The first metallic coating is formed on the first color layer and completely covers the first color layer. The second color layer is formed on the first metallic coating and directly covers the portions of the internal surface which is uncovered by the first color layer. The second color layer and the first color layer have different colors. The second color layer and the first color layer are transparent or translucent. A method for manufacturing the electronic device housing is also provided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully