Electronic device housing and method for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 19, 2016
Issued Date -
N/A
app pub date -
Dec 10, 2012
filing date -
Jun 1, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully