Waterproof surface mount device package and method
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United States of America Patent
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Jan 19, 2016
Grant Date -
May 31, 2012
app pub date -
Nov 30, 2010
filing date -
Nov 30, 2010
priority date (Note) -
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Abstract
The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.
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