High yield semiconductor device
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United States of America Patent
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Jan 19, 2016
Grant Date -
Mar 5, 2015
app pub date -
Aug 1, 2014
filing date -
Aug 30, 2013
priority date (Note) -
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Abstract
A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.
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