Method for detaching a semiconductor chip from a foil
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United States of America Patent
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Jan 19, 2016
Grant Date -
Jul 17, 2014
app pub date -
Nov 20, 2013
filing date -
Nov 23, 2012
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Abstract
The invention relates to the prepeeling phase of methods for detaching a semiconductor chip from a foil. According to a first aspect, the invention relates to the determination of time periods, which each defines a duration of a prepeeling step. In a setup phase, the following steps are carried out for each prepeeling step:
- Initiating the method step;Repeating the two steps Recording of an image of the semiconductor chip and assignment of a time period to the image which has passed since the initiation of the prepeeling step, andChecking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value;until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value.
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