Winding and method for preparing a winding applied to an inductive device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 19, 2016
Grant Date -
Apr 2, 2015
app pub date -
Oct 30, 2013
filing date -
Sep 29, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a winding and a method for preparing a winding of inductive devices. The winding includes at least a plurality of layers, where each layer includes at least one conductive loop; the conductive loops are electrically connected to form a winding; and the conductive loop or the portion of the conductive loop of at least one layer is not spatially aligned with the conductive loop or the portion of the conductive loop of at least one another layer. The winding may be prepared by adopting a PCB process or semiconductor process, which can effectively consume less of surface area on the integration substrate, have a symmetric trace and reduce the parasitic coupling capacitance while acquiring a high Q-factor value. The windings of the present invention may be used for making an inductor or a transformer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully