Stacked-die multi-processor

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United States of America Patent

PATENT NO 9240220
SERIAL NO

14810905

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Abstract

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A plurality of stacked dies has outer dies that permits high heat dissipation. A plurality of processors is located on a first outer die. A plurality of memory elements located on a second outer die. An interconnect structure is located an inner die.

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Patent Owner(s)

Patent OwnerAddress
SCIENTIA SOL MENTIS AGNEUHOFSTRASSE 1 SCHINDELLEGI 8834

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Vorbach, Martin Lingenfeld, DE 174 5665

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