Hybrid adhesive and the use thereof in engineered wood boards
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United States of America Patent
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Jan 19, 2016
Grant Date -
Dec 12, 2013
app pub date -
Oct 21, 2011
filing date -
Oct 27, 2010
priority date (Note) -
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Abstract
The present invention relates to a hybrid adhesive, in particular for use in the production of engineered wood such as particle boards, fiber boards, plywood or glued-laminated timber, comprising at least one polycondensation adhesive, at least one polyaddition adhesive, and at least one particular, in particular a nanoparticle smaller than 500 nm, wherein the at least one particle is modified with at least one compound of the general Formula (I) RaSiX(4-a), or the general Formula (II) ObXc(OH)dReSiO(4-b-c-d-e)/2. The present invention also relates to the use of the adhesive in engineered wood boards and to methods for the production thereof.
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