Semiconductor device including embedded controller die and method of making same
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United States of America Patent
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Jan 12, 2016
Grant Date -
Jul 30, 2015
app pub date -
Jan 28, 2013
filing date -
Jan 28, 2013
priority date (Note) -
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Abstract
A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).
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