Adjustment mechanism of mold system having electrically adjusting and positioning functions

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United States of America Patent

PATENT NO 9233496
APP PUB NO 20120273983A1
SERIAL NO

13455214

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Abstract

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A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivotally-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCESNO 415 JIANGONG RD SANMIN DISTRICT KAOHSIUNG CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Kai-En Taichung, TW 1 0
Chiu, Cheng-Hao Kaohsiung, TW 8 3
Wu, Cheng-Hsien Kaohsiung, TW 195 5583
Wu, Chieh-Ju Taichung, TW 1 0

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