Semiconductor device including alternating stepped semiconductor die stacks

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United States of America Patent

PATENT NO 9230942
APP PUB NO 20150228621A1
SERIAL NO

14422179

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Abstract

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A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.

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Patent Owner(s)

  • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Chin-Tien Taichung, TW 83 470
Huang, Dacheng Shanghai, CN 4 77
Ji, Zhongli Shanghai, CN 17 54
Kumar, Shiv Saharanpur, IN 111 2696
Lu, Zhong Shanghai, CN 29 172

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