Sensor and method of providing a sensor
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United States of America Patent
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Jan 5, 2016
Grant Date -
Apr 12, 2012
app pub date -
Dec 14, 2011
filing date -
Jul 14, 2006
priority date (Note) -
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Abstract
Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.
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