Method of making a flexible circuit
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United States of America Patent
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Dec 29, 2015
Grant Date -
Apr 23, 2015
app pub date -
Jan 24, 2013
filing date -
Feb 2, 2012
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Abstract
A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.
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