Ruggedized low-relection/high-transmission integrated spindle for parallel-plate transmission-line structures

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United States of America Patent

PATENT NO 9225052
APP PUB NO 20150061796A1
SERIAL NO

14013055

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Abstract

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A radio frequency (RF) transmission-line structure includes a parallel-plate transmission line formed from a first conducting plate and a second conducting plate. The second conducting plate is spaced apart from the first conducting plate and substantially parallel to the first conducting plate. A support member is attached to the first and second plates and is operative to maintain a fixed mechanical spacing between the first conducting plate and the second conducting plate. The transmission-line structure further includes at least one feature configured to isolate or suppress RF interaction of the support member with RF fields within the parallel-plate transmission line.

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Patent Owner(s)

Patent OwnerAddress
THINKOM SOLUTIONS INC4881 WEST 145TH STREET HAWTHORNE CA 90250

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Milroy, William Torrance, US 18 83
Sor, James San Pedro, US 7 421

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