Opto-electronic module and method for manufacturing the same
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United States of America Patent
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Dec 29, 2015
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app pub date -
Aug 8, 2012
filing date -
Aug 10, 2011
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Abstract
A method for manufacturing a device that includes an opto-electronic module includes creating a wafer stack including multiple active optical components mounted on a substrate wafer, and an optics wafer including multiple passive optical components. The optics wafer can include a blocking portion, which is substantially non-transparent for at least a specific wavelength range, and a transparent portion, which is substantially non-transparent for the specific wavelength range. Each opto-electronic module includes a substrate member, an optics member, an active optical component mounted on the substrate member, and a passive optical component. The optics member is directly or indirectly fixed to the substrate member. The opto-electronic modules can have excellent manufacturability, small dimensions and high alignment accuracy.
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