Photosensitive resin composition and applications of the same

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United States of America Patent

PATENT NO 9223206
APP PUB NO 20130277627A1
SERIAL NO

13798541

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Abstract

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A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a solvent, (F) a black pigment, and (G) a metal chelate. The alkali-soluble resin (A) includes an unsaturated-group-containing resin (A-1) obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization.

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Patent Owner(s)

Patent OwnerAddress
CHI MEI CORPORATIONTAINAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Hao-Wei Tainan, TW 18 48
Tseng, Ching-Yuan Jhongli, TW 10 32

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