Solder alloy, solder paste, and electronic circuit board
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United States of America Patent
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Dec 29, 2015
Grant Date -
Jul 2, 2015
app pub date -
Nov 16, 2012
filing date -
Jun 29, 2012
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Abstract
A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.
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