Solder alloy, solder paste, and electronic circuit board
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United States of America Patent
Stats
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Dec 29, 2015
Grant Date -
May 21, 2015
app pub date -
Jun 25, 2013
filing date -
Jun 29, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- B23K Class
- 13.67 % this patent is cited more than
- 10 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 29, 2027 |
