Al-Ni-La system Al-based alloy sputtering target
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United States of America Patent
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Dec 15, 2015
Grant Date -
May 29, 2008
app pub date -
Oct 31, 2007
filing date -
Nov 20, 2006
priority date (Note) -
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Abstract
The invention relates to an Al—Ni—La system Al-based alloy sputtering target where a total area of an Al—Ni system intermetallic compound having an average particle diameter of 0.3 μm to 3 μm with respect to a total area of the entire Al—Ni system intermetallic compound is 70% or more in terms of an area fraction, and a total area of an Al—La system intermetallic compound having an average particle diameter of 0.2 μm to 2 μm with respect to a total area of the entire Al—La system intermetallic compound is 70% or more in terms of an area fraction.
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