No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the same
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United States of America Patent
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Dec 8, 2015
Grant Date -
Sep 18, 2014
app pub date -
May 28, 2014
filing date -
Nov 28, 2011
priority date (Note) -
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Abstract
A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of I/O pads formed on the metal substrate, and extending to the proximity of the die. The no-exposed-pad QFN packaging structure also includes a first metal layer containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die and is formed on the metal substrate by a multi-layer electrical plating process. Further, the no-exposed-pad QFN packaging structure includes metal wires connecting the die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads.
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