Quad flat no-lead (QFN) packaging structure and method for manufacturing the same
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United States of America Patent
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Dec 8, 2015
Grant Date -
Oct 30, 2014
app pub date -
Apr 24, 2014
filing date -
Nov 22, 2011
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Abstract
A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first outer die pad formed on the metal substrate, and a first die coupled to a top surface of the first outer die pad. The QFN packaging structure also includes a plurality of I/O pads formed on the metal substrate, and a first metal layer containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die. The first metal layer is formed on the metal substrate by a multi-layer electrical plating process such that a lead pitch of the plurality of inner leads is significantly reduced. Further, the QFN packaging structure includes metal wires connecting die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads and the die pad.
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