Systems and methods for distributing power to integrated circuit dies
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United States of America Patent
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Dec 8, 2015
Grant Date -
Jun 5, 2014
app pub date -
Dec 14, 2012
filing date -
Dec 3, 2012
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Abstract
Systems and methods for distributing power to a plurality of integrated circuit dies are provided. In some aspects, a system includes a substrate and a plurality of integrated circuit dies disposed on the substrate. Each of the plurality of integrated circuit dies includes a circuit and a target inductive element coupled to the circuit. The system also includes a power supply module configured to generate a source power signal. The system also includes at least one source inductive element configured to electromagnetically couple the source power signal to one or more of the plurality of the target inductive elements to generate one or more target power signals that supply power to one or more corresponding circuits.
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