Method for producing perforated or partially perforated stencils with a relief
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United States of America Patent
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Dec 8, 2015
Grant Date -
Feb 12, 2015
app pub date -
Oct 27, 2014
filing date -
Oct 23, 2009
priority date (Note) -
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Abstract
A method is provided for producing a stencil having a relief with multiple openings on its upper side. The contours correspond to a desired pattern and to a stencil of this type. The stencil has a body with at least one non-perforated non-metal relief layer, which allows greater relief heights and increased freedom of design. The relief layer is removed according to the pattern by laser or plasma radiation to form the multiple openings. Through-openings extending to a rear side opposite the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body may be obtained, having at least one non-metal relief layer, formed in the upper side of which is a relief with multiple openings, the contours of which correspond to a desired pattern. Through-openings extending to a rear side opposite from the upper side are provided.
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