Transferable probe tips
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United States of America Patent
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Dec 1, 2015
Grant Date -
Nov 8, 2012
app pub date -
May 5, 2011
filing date -
May 5, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- G01Q:SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIO....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- G01B:MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIME....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
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