Metal laminated structure and method for producing the metal laminated structure

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United States of America Patent

PATENT NO 9199433
APP PUB NO 20120100392A1
SERIAL NO

13381703

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Abstract

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There is provided a metal laminated structure comprising a first metal layer, a second metal layer and a third metal layer, the first metal layer being disposed on one surface of the second metal layer, the third metal layer being disposed on the other surface of the second metal layer, the first metal layer including at least one of tungsten and molybdenum, the second metal layer including copper, the third metal layer including at least one of tungsten and molybdenum, and a method for producing the metal laminated structure.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA
A L M T CORPTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Yugaku Sakata, JP 15 79
Inazawa, Shinji Osaka, JP 104 675
Majima, Masatoshi Osaka, JP 169 532
Nitta, Koji Osaka, JP 166 415
Suwata, Osamu Sakata, JP 5 37
Yamagata, Shinichi Sakata, JP 10 82
Yokoyama, Hiroshi Sakata, JP 168 2188

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